Applied Materials 23835-503 / 932T0016-503-1198 / 6LVV-P1V222P-BA CMP Carrier Head – Chemical Mechanical Planarization System
When a CMP carrier head fails mid-process, the consequences cascade instantly: wafer batches are scrapped, polishing tools sit idle, and fab throughput collapses. In advanced semiconductor manufacturing, the carrier head is the mechanical heart of the CMP station — it holds, pressurizes, and rotates the wafer against the polishing pad with micron-level precision. Without a verified, specification-matched replacement, production cannot resume safely.
The Applied Materials 23835-503 (cross-reference: 932T0016-503-1198 / 6LVV-P1V222P-BA) is a precision CMP carrier head engineered for Applied Materials’ Chemical Mechanical Planarization systems. With an outer diameter of 34 cm and inner diameter of 29.5 cm, this carrier head is designed to deliver uniform wafer-surface pressure distribution across the polishing interface — a critical requirement for achieving sub-nanometer planarization uniformity in leading-edge logic and memory device fabrication. Applied Materials CMP platforms are deployed in virtually every Tier-1 semiconductor fab globally, making this component one of the most operationally critical spare parts in the industry.
Technical Specifications
- Part Number: 23835-503
- Cross Reference: 932T0016-503-1198 / 6LVV-P1V222P-BA
- Outer Diameter (OD): 34 cm
- Inner Diameter (ID): 29.5 cm
- Component Type: CMP Carrier Head
- Manufacturer: Applied Materials (AMAT)
- Application: Chemical Mechanical Planarization (CMP)
- Weight: 2,600 g (approx.)
- Condition: New / Refurbished (specify on inquiry)
Key Features & Benefits
- Precision Dimensional Tolerances: OD 34 cm / ID 29.5 cm geometry ensures correct seating and wafer retention within the CMP tool chamber.
- Multi-Zone Pressure Control Compatibility: Designed to interface with Applied Materials’ multi-zone pressure membrane systems for uniform material removal rate (MRR) across the wafer surface.
- Cross-Referenced Part Numbers: Verified compatibility across three AMAT part number formats (23835-503, 932T0016-503-1198, 6LVV-P1V222P-BA), reducing procurement risk.
- Minimized Downtime: Direct OEM-specification replacement eliminates re-qualification time versus non-spec alternatives.
- Cleanroom-Compatible Packaging: Shipped in protective packaging suitable for semiconductor fab receiving environments.
Industry & Equipment Applications
- Semiconductor wafer fabrication (logic, DRAM, NAND Flash)
- Applied Materials Mirra, Reflexion, and related CMP platform families
- Advanced packaging and 3D IC integration processes
- R&D and pilot-line CMP tool maintenance
- Fab equipment refurbishment and tool requalification programs
System Integration & Compatible Parts
This carrier head is designed for integration within Applied Materials CMP tool assemblies. Compatible and frequently co-ordered components include CMP polishing pads, retaining rings, membrane assemblies, conditioner discs, and slurry delivery system components. When sourcing a carrier head replacement, it is recommended to simultaneously inspect the retaining ring and membrane for wear to avoid repeat downtime events. Contact Konmask.com for bundled sourcing support.
Our Quality Assurance Process
- Part Number Verification: Every unit is cross-checked against AMAT documentation to confirm part number authenticity before shipment.
- Physical Inspection: Dimensional checks (OD/ID), surface condition review, and mechanical integrity assessment are performed on all units.
- Traceability: Units are traceable to original manufacturer or certified refurbishment source.
- Packaging Integrity: Anti-static and contamination-control packaging applied prior to dispatch.
How to Order
Konmask.com operates as a B2B industrial parts sourcing platform. To request a quote or check availability for the Applied Materials 23835-503 CMP Carrier Head:
- Submit an inquiry via the Contact / RFQ form on this page.
- Email: [email protected]
- Phone / WhatsApp: +0086 19859288691
- Provide your required quantity, delivery timeline, and destination country for an accurate quotation.
Why Choose Konmask.com?
- Semiconductor-Specialized Sourcing: Deep expertise in AMAT, Lam Research, KLA, and TEL spare parts procurement.
- Global Supply Network: Access to verified surplus, refurbished, and new-old-stock (NOS) semiconductor equipment components worldwide.
- Fast Response: RFQ responses within 24 business hours for standard inquiries.
- Export Compliance: Experienced in cross-border industrial equipment export documentation and logistics coordination.
- Technical Support: Our team includes engineers with hands-on CMP process and equipment experience.
Frequently Asked Questions
- Q: Is the 23835-503 compatible with the Mirra CMP platform?
- A: This carrier head is listed under Applied Materials CMP system components. Please confirm your specific tool model and generation with our technical team before ordering to ensure dimensional and interface compatibility.
- Q: What is the difference between part numbers 23835-503, 932T0016-503-1198, and 6LVV-P1V222P-BA?
- A: These are cross-reference part numbers used across different AMAT documentation systems and procurement databases. They refer to the same physical component. Konmask.com has verified this cross-reference mapping.
- Q: Do you supply new or refurbished units?
- A: We can source both new and certified-refurbished units depending on availability and your budget requirements. Please specify your preference in your RFQ.
- Q: What is the lead time for this part?
- A: Lead time varies by stock availability and your location. Submit an inquiry for a real-time availability check and estimated delivery timeline.
- Q: Can you provide export documentation for international shipments?
- A: Yes. Konmask.com supports international B2B shipments with standard commercial invoice, packing list, and certificate of origin documentation.
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