EUPEC BSM200GB170DLC – 200A 1700V Dual IGBT Power Module | EUPEC FF Series
Engineering Background: The BSM200GB170DLC is a high-voltage, high-current IGBT module manufactured by EUPEC (now part of Infineon Technologies), engineered for demanding power conversion applications. Built on EUPEC’s proven trench-gate IGBT technology, this module delivers exceptional switching performance and thermal reliability in a compact, industry-standard package.
Product Positioning: Designed for procurement engineers and system integrators specifying components for industrial variable-frequency drives (VFDs), medium-voltage inverters, UPS systems, and traction converters. The BSM200GB170DLC is a direct-fit replacement and upgrade path for legacy EUPEC FF-series installations, with full Infineon lineage traceability.
Complete Technical Specifications
- Part Number: BSM200GB170DLC
- Manufacturer: EUPEC (Infineon Technologies)
- Module Type: Dual (Half-Bridge) IGBT Module
- Collector-Emitter Voltage (VCES): 1700 V
- Continuous Collector Current (IC): 200 A @ TC = 80°C
- Peak Collector Current (ICRM): 400 A
- Gate-Emitter Voltage (VGES): ±20 V
- Saturation Voltage (VCE(sat)): ≤ 2.7 V @ IC = 200 A
- Switching Frequency: Up to 2 kHz (recommended)
- Thermal Resistance (Rth(j-c)): 0.10 K/W per IGBT
- Operating Junction Temperature (Tj): -40°C to +150°C
- Storage Temperature (Tstg): -40°C to +125°C
- Isolation Voltage (Visol): 4000 Vrms (1 min)
- Package: IGBT Module – 62mm standard footprint
- Weight: ~320 g
- Mounting: Screw-mount baseplate, compatible with standard heatsinks
- Freewheeling Diode: Integrated fast-recovery anti-parallel diode per IGBT
- RoHS Compliance: Consult datasheet for specific revision status
Proven Application Environments
- Industrial variable-frequency drives (VFDs) – 690V AC bus systems
- Medium-voltage motor control and soft-starters
- Three-phase PWM inverters and active front-end rectifiers
- Uninterruptible power supplies (UPS) – online double-conversion topology
- Traction inverters and railway auxiliary converters
- Induction heating and welding power supplies
- Renewable energy inverters (wind, solar string/central inverters)
- STATCOM and reactive power compensation systems
Engineering Advantages
- Trench-Gate IGBT Technology: Lower VCE(sat) reduces conduction losses, improving system efficiency at full load.
- Integrated Fast-Recovery Diodes: Optimized reverse-recovery characteristics minimize switching losses and EMI in hard-switching topologies.
- High Isolation Voltage: 4000 Vrms isolation supports safe operation in high-voltage bus architectures without additional isolation barriers.
- Robust Thermal Design: Low Rth(j-c) and copper baseplate enable high power density with standard forced-air or liquid-cooled heatsinks.
- Industry-Standard 62mm Package: Drop-in compatible with existing PCB layouts and heatsink assemblies, reducing redesign cost.
- Infineon Lineage: Full datasheet, SPICE models, and application notes available through Infineon’s technical library.
System Architecture & Signal Flow
The BSM200GB170DLC implements a half-bridge (dual) topology with two IGBT switches (T1 upper, T2 lower) and two anti-parallel freewheeling diodes in a single module. Gate drive signals are applied independently to each IGBT via dedicated G/E terminals. The DC bus connects across the collector of T1 (+) and emitter of T2 (–), with the AC output taken from the midpoint. Recommended gate drive: +15V / –8V with 10–22 Ω gate resistor. Dead-time insertion (≥ 2 µs) is mandatory to prevent shoot-through. Thermal interface material (TIM) with λ ≥ 1 W/m·K should be applied between baseplate and heatsink.
Sourcing & Quality Verification
- Origin: Genuine EUPEC / Infineon production; sourced through authorized distribution channels.
- Traceability: Date code, lot number, and country of origin available upon request for each shipment.
- Inspection: All units undergo incoming visual inspection and electrical parameter spot-check before dispatch.
- Packaging: Anti-static tray or original OEM packaging; moisture-sensitive level (MSL) compliant storage.
- Documentation: Certificate of conformance (CoC) and original datasheet provided with each order.
Procurement Process
- Submit your BOM or part number inquiry via the product page or email support@konmask.com.
- Receive a formal quotation with lead time, quantity availability, and unit pricing within 1 business day.
- Confirm purchase order (PO) with agreed Incoterms (EXW / FOB Xiamen available).
- Payment via T/T, PayPal, or trade credit (approved accounts).
- Shipment via DHL / FedEx / UPS with full tracking; export documentation (commercial invoice, packing list, COO) included.
- Post-delivery technical support available via email or WhatsApp.
Technical FAQ
Q: Is the BSM200GB170DLC still in production?
A: EUPEC has been integrated into Infineon Technologies. This part may be available as new-old-stock (NOS) or through Infineon’s successor part program. Contact us for current availability.
Q: What is the recommended gate drive voltage?
A: +15V (on) / –8V (off) with a gate resistor of 10–22 Ω. Refer to the Infineon application note AN2011-05 for detailed gate drive design guidelines.
Q: Can this module replace BSM200GB170DN2?
A: The DLC and DN2 suffixes indicate different internal configurations. Verify pinout, VCE(sat), and switching characteristics against your circuit requirements before substitution.
Q: What TIM (thermal interface material) is recommended?
A: Use a phase-change pad or silicone-based TIM with thermal conductivity ≥ 1 W/m·K. Apply uniformly to the baseplate; torque mounting screws to 3–4 N·m.
Q: Do you provide SPICE or simulation models?
A: Infineon provides SPICE models for this series via their online model library. We can assist in locating the correct model file upon request.
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