Lam Research DGF 810-031325-033 IGS Motherboard | TA2019 Platform
Engineering Background
The DGF 810-031325-033 is a high-density integrated gate signal (IGS) motherboard engineered for Lam Research’s TA2019 etch and deposition systems. It serves as the central signal-routing and power-distribution backbone within the system’s control architecture, interfacing directly with process modules, RF generators, and endpoint detection subsystems.
Product Positioning
Designed for semiconductor OEM maintenance engineers and process equipment managers, this board is a direct OEM replacement for aging or failed IGS motherboard assemblies. Konmask.com supplies verified, tested units with full traceability to support planned maintenance and emergency recovery scenarios.
Complete Technical Specifications
- Manufacturer: Lam Research Corporation
- Part Number (Primary): DGF 810-031325-033
- Assembly Reference: TA2019
- Secondary P/N: 19-131418-00
- Board Revision References: Z1563A / E3913B0 / E4211E0 / E4010A2
- Internal Reference: 18-25-08823
- Board Type: IGS (Integrated Gate Signal) Motherboard
- Form Factor: Multi-slot backplane motherboard
- Weight: 2,600 g (approx.)
- Compatibility: Lam Research TA2019 etch/CVD platform
- Condition: Refurbished / Tested / OEM-equivalent
Proven Application Environments
- 300 mm wafer fab etch chambers (Lam Kiyo, Flex series)
- CVD / ALD deposition tool control systems
- RF match network and generator interface boards
- Endpoint detection and process control signal routing
- Fab maintenance, spare-parts inventory, and emergency tool recovery
Engineering Advantages
- OEM-Identical Form & Fit: Drop-in replacement — no firmware modification required
- Multi-Revision Coverage: Covers Z1563A, E3913B0, E4211E0, E4010A2 board revisions under a single P/N
- Functional Test Verified: Each unit undergoes power-on and signal-integrity verification prior to shipment
- Traceability: Full part-number and revision documentation provided with each unit
- Lead-Time Advantage: In-stock availability vs. 16–52 week OEM lead times
System Architecture & Signal Flow
The IGS Motherboard acts as the primary interconnect layer within the TA2019 control chassis. Daughter cards (I/O, RF control, endpoint) plug into the motherboard’s edge connectors. The board distributes regulated DC power rails (+5 V, ±15 V, +24 V) and routes digital/analog control signals between the system controller (VME/PCI bus) and field-level process actuators. The DGF prefix designates the board’s role in the Digital Gate Function subsystem, responsible for interlock logic and process-state sequencing.
Sourcing & Quality Verification
- Units sourced from decommissioned Lam Research tools and certified refurbishers
- Visual inspection: no burnt components, cracked PCB traces, or corroded connectors
- Functional power-on test with load simulation
- ESD-safe packaging with anti-static foam and moisture barrier bag
- Serialized shipping documentation available on request
Procurement Process
- Submit RFQ via Konmask.com/contact or email [email protected]
- Receive quote with lead time and condition report within 24 business hours
- Confirm PO — payment via T/T, PayPal, or credit card accepted
- Unit ships within 1–3 business days via DHL / FedEx with tracking
- 30-day DOA warranty; extended warranty available on request
Technical FAQ
Q: Is this board compatible with Lam Research Flex series tools?
A: Compatibility depends on the specific Flex chassis revision. Please provide your tool serial number for cross-reference confirmation.
Q: Can you supply the matching daughter cards (I/O, RF)?
A: Yes. Contact us with your full BOM and we will source matched assemblies.
Q: What is the difference between revision Z1563A and E3913B0?
A: These are PCB fabrication revisions with minor layout changes; functionally interchangeable within the TA2019 platform per Lam Research service documentation.
Q: Do you provide a test report?
A: A functional test summary is available upon request for orders above USD 500.
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