SAMSUNG K3QF6F60MM-QGCF 16GB eMMC NAND Flash Memory IC | Replacement, Equivalent & Selection Guide
The SAMSUNG K3QF6F60MM-QGCF is a high-density 16GB eMMC 5.1 NAND Flash memory IC widely used in embedded systems, industrial control boards, consumer electronics, and mobile platforms. This page provides full technical specifications, compatible replacement models, application guidance, and sourcing information to help engineers and procurement teams make confident decisions.
Technical Specifications
| Part Number | K3QF6F60MM-QGCF |
| Manufacturer | Samsung Semiconductor |
| Memory Type | NAND Flash (eMMC) |
| Capacity | 16GB (128Gb) |
| Interface Standard | eMMC 5.1 |
| Bus Width | 8-bit HS400 |
| Operating Voltage | 1.8V / 3.3V |
| Package | 153-ball FBGA |
| Operating Temperature | -25°C to +85°C |
| Sequential Read Speed | Up to 300 MB/s |
| Sequential Write Speed | Up to 100 MB/s |
| NAND Cell Type | MLC / TLC (Samsung V-NAND) |
| RoHS Compliant | Yes |
Compatible Replacement & Equivalent Models
The following models are functionally compatible or pin-compatible alternatives to the K3QF6F60MM-QGCF. Always verify footprint, voltage, and firmware compatibility before substitution:
| Part Number | Manufacturer | Capacity | Interface | Compatibility Notes |
|---|---|---|---|---|
| K3QF6F60MM-QGCJ | Samsung | 16GB | eMMC 5.1 | Direct replacement, different temp grade |
| K3UF6F60BM-QGCF | Samsung | 16GB | eMMC 5.1 | Upgraded V-NAND revision |
| THGBMHG8C4LBAIL | Kioxia (Toshiba) | 16GB | eMMC 5.1 | Cross-brand equivalent, verify BGA pitch |
| MTFC16GAPALBH-IT | Micron | 16GB | eMMC 5.1 | Industrial-grade alternative |
| FEMDNN016G-A8A39 | SK Hynix | 16GB | eMMC 5.1 | Pin-compatible, confirm firmware support |
Note: Cross-brand replacements may require firmware or driver adjustments. Consult your hardware engineer before substitution.
Why Choose the Original Model
- Samsung V-NAND Technology — Superior endurance and reliability vs. planar NAND alternatives
- eMMC 5.1 HS400 Mode — Highest throughput in the eMMC standard, ideal for demanding embedded workloads
- Proven Supply Chain — Long-term availability backed by Samsung’s global manufacturing
- Wide Ecosystem Support — Compatible with Linux, Android, RTOS, and major SoC platforms
- Industrial Temperature Option — Suitable for harsh-environment deployments
Typical Applications
- Industrial HMI panels and embedded control boards
- Android-based POS terminals and kiosk systems
- Automotive infotainment and telematics units
- Network equipment: routers, switches, gateways
- Medical device storage subsystems
- Single-board computers (SBC) and development platforms
- Smart home hubs and IoT edge devices
System Compatibility
The K3QF6F60MM-QGCF is compatible with the following SoC families and platforms:
- Qualcomm Snapdragon — SDM series with eMMC 5.1 host controller
- MediaTek MT67xx / MT68xx — Full HS400 support
- Rockchip RK3288 / RK3399 / RK3568 — Widely deployed in industrial SBCs
- NXP i.MX 6/7/8 — Industrial-grade embedded platforms
- Allwinner H6 / H616 — Consumer and IoT applications
- Linux Kernel 4.x+ — Native eMMC 5.1 driver support
- Android 8.0+ — Full HS400 mode support
Selection Guide
Use the following criteria to confirm the K3QF6F60MM-QGCF is the right choice for your design:
- Capacity requirement: 16GB — if you need 8GB or 32GB, see Samsung K3QF4F40BM or K3LH6H60MM series
- Interface: Confirm your host controller supports eMMC 5.1 / HS400 mode
- Package: 153-ball FBGA — verify PCB footprint matches before ordering
- Temperature range: Standard (-25°C to +85°C); for extended range (-40°C to +105°C), request industrial suffix variant
- Voltage: Dual-voltage 1.8V (I/O) + 3.3V (core) — confirm power rail availability on your board
- Endurance: For write-intensive applications (logging, databases), consider Samsung’s industrial eMMC lineup
Quality Assurance & Sourcing
- ✅ Authentic Components Only — All parts sourced from authorized distributors or verified secondary market channels
- ✅ Anti-Counterfeit Inspection — Visual, electrical, and X-ray inspection available on request
- ✅ Traceability — Date code and lot number documentation provided
- ✅ Testing — Functional read/write verification available for bulk orders
- ✅ Packaging — ESD-safe tray or tape-and-reel per JEDEC standards
How to Order
- Add the K3QF6F60MM-QGCF to your cart and complete checkout, or
- Contact us directly for bulk pricing, lead time, and custom packaging requirements
- Provide your target quantity, required date code, and any inspection requirements
- Receive a formal quotation within 1 business day
📧 Email: support@konmask.com
📞 Phone/WhatsApp: +0086 19859288691
🌐 Website: https://Konmask.com
Replacement & Compatibility FAQ
Q: Can I directly replace K3QF6F60MM-QGCF with a Micron or Kioxia equivalent?
A: Physically yes if the BGA footprint matches, but firmware initialization sequences may differ. Always validate with your BSP team.
Q: What is the difference between K3QF6F60MM-QGCF and K3QF6F60MM-QGCJ?
A: The suffix indicates temperature grade and packaging specification. The -QGCF is the standard commercial grade; -QGCJ may indicate a different qualification level. Confirm with Samsung’s datasheet.
Q: Is this part available in tape-and-reel for SMT production?
A: Yes. Please specify T&R packaging when placing your order.
Q: Do you provide a certificate of conformance (CoC)?
A: Yes, CoC and test reports are available for qualified orders upon request.
Q: What is the minimum order quantity (MOQ)?
A: MOQ is 1 piece for sample orders. Volume pricing starts from 10 pieces.
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