Honeywell 10101/2/1 – Digital Input Module | TDC 3000 / TotalPlant Solution (TPS)
Engineering Background: The Honeywell TDC 3000 / TotalPlant Solution (TPS) platform is one of the most widely deployed Distributed Control Systems in continuous-process industries, with an installed base spanning refineries, power generation facilities, and municipal water treatment plants built from the 1980s through the 2000s. Within this architecture, the Digital Input (DI) module serves as the primary field-signal acquisition layer — translating discrete on/off states from field devices (valve limit switches, motor run/stop contacts, pressure switches, level switches) into process data that the High-Performance Process Manager (HPPM) or Process Manager (PM) can act upon in real time. The 10101/2/1 occupies a critical role in the I/O subsystem: without reliable DI acquisition, alarm management, interlock logic, and safety shutdown sequences cannot execute correctly.
Product Positioning: The 10101/2/1 is a standard-density digital input module designed for the TDC 3000 / TPS I/O Link architecture. It is distinguished from higher-density variants (e.g., 32-channel DI modules) by its channel count and per-channel isolation characteristics, making it the preferred choice where per-point diagnostic resolution and individual channel fusing are operationally required. It is not a Safety Instrumented System (SIS) module and should not be substituted into IEC 61511 SIL-rated loops without a formal functional safety assessment. Applicable boundary conditions: existing TDC 3000 / TPS cabinets with standard I/O Link backplanes, 24 VDC field wiring infrastructure, and non-SIS discrete input applications.
Complete Technical Specifications
Electrical
- Module Type: Digital Input (DI)
- Input Voltage Range: 24 VDC nominal (field-side)
- Logic State Thresholds: ON ≥ 11 VDC; OFF ≤ 5 VDC (typical TDC 3000 DI thresholds)
- Input Isolation: Optical isolation, channel-to-backplane
- Power Consumption: Per TDC 3000 I/O subsystem power budget (refer to Honeywell PM/HPPM I/O specification)
- Backplane Interface: TDC 3000 / TPS standard I/O Link
- Fusing: Per-module or per-channel (refer to cabinet drawing)
Mechanical
- Form Factor: Standard TDC 3000 I/O module card
- Mounting: TDC 3000 I/O carrier / backplane slot
- Connector: Rear-termination via I/O carrier field terminal block
- Weight: Approx. 100 g (module card only)
- Part Number / SKU: 10101/2/1
Environmental
- Operating Temperature: 0 °C to 60 °C (typical TDC 3000 module rating)
- Storage Temperature: −40 °C to 85 °C
- Relative Humidity: 5% to 95% non-condensing
- Vibration / Shock: Per Honeywell TDC 3000 environmental qualification
- Installation Category: Indoor, climate-controlled control room or marshalling cabinet
Certifications
- CE Marking: Applicable per Honeywell product documentation
- UL / cUL: Per Honeywell TDC 3000 system certification
- RoHS: Confirm with Honeywell product revision documentation
- Note: This module is not independently SIL-rated; SIS applications require Honeywell Safety Manager or equivalent certified hardware.
Data source: Honeywell TDC 3000 / TPS I/O Module Product Specification, Honeywell Process Solutions technical documentation. Specifications subject to hardware revision; verify against Honeywell part revision suffix prior to installation.
Proven Application Environments
- Petroleum Refining — Crude Distillation Unit (CDU): Monitoring pump run/stop status and valve open/close limit switches under continuous 24/7 operation at elevated ambient temperatures in process areas.
- Power Generation — Coal-Fired Boiler Control: Acquiring discrete signals from induced-draft fan motor contactors and damper position switches, where signal integrity under high-EMI environments is mandatory.
- Municipal Water Treatment — Filtration Plant: Reading discrete states from chemical dosing pump contactors and high-level float switches in corrosive, high-humidity marshalling environments.
- Petrochemical — Ethylene Cracker: Interfacing with emergency shutdown valve (ESDV) limit switches for process status monitoring (non-SIS monitoring loop), with high channel availability requirements.
- LNG Terminal — Loading Arm Control: Capturing discrete position feedback from loading arm interlocks and ESD pushbutton stations in marine-adjacent environments with strict EMC requirements.
- Pulp & Paper — Recovery Boiler: Monitoring discrete inputs from black liquor pump seal-flush pressure switches and smelt spout position sensors under high-vibration, high-humidity plant conditions.
Engineering Advantages
- For high-EMI process areas, this digital input module provides optical isolation between field wiring and the backplane bus, because galvanic separation prevents ground-loop noise from corrupting discrete state data in the HPPM.
- For aging TDC 3000 installations requiring like-for-like replacement, this module maintains full backward compatibility with existing I/O Link backplanes and carrier assemblies, because the hardware interface and firmware handshake protocol are preserved across the TDC 3000 product lifecycle.
- For plants operating under tight maintenance windows, this module supports hot-swap replacement within the TDC 3000 I/O subsystem, because the I/O Link architecture allows module substitution without full system shutdown when properly sequenced.
- For procurement engineers managing multi-site spares programs, this module’s standardized part number (10101/2/1) enables cross-site inventory pooling, because the module is functionally identical across TDC 3000 and TPS cabinet generations.
- For facilities with strict documentation requirements, this module is supported by Honeywell’s full technical documentation ecosystem — including installation guides, functional specifications, and revision history — because Honeywell maintains long-term documentation archives for TDC 3000 platform components.
- For operations teams managing alarm rationalization projects, this module’s per-channel optical isolation simplifies fault diagnosis, because individual channel failures are electrically contained and do not cascade to adjacent input points.
System Architecture & Signal Flow
Signal Flow: Field discrete device (valve limit switch / motor contactor / pressure switch) → Field terminal block on I/O carrier → 10101/2/1 DI module optical isolator → I/O Link backplane → Process Manager (PM) or High-Performance Process Manager (HPPM) → TDC 3000 / TPS control network → Operator Station (US) / Application Module (AM) for alarm processing and logic execution.
Compatible Hardware:
- I/O Carriers / Backplanes: Standard TDC 3000 I/O carrier assemblies compatible with the 10101/2/1 module slot footprint.
- Controllers: Honeywell Process Manager (PM), High-Performance Process Manager (HPPM), and compatible TPS controller variants — all of which communicate via the I/O Link protocol that this module implements.
- Power Supplies: TDC 3000 standard cabinet power supply assemblies providing regulated 24 VDC field power and backplane logic power.
Substitution Conditions: Direct substitution with other Honeywell TDC 3000 DI modules is permissible only when the replacement module shares the same part number revision or is explicitly listed as a functional equivalent in Honeywell’s supersession documentation. Cross-substitution with non-Honeywell DI modules requires full I/O Link protocol compatibility verification and is not recommended without Honeywell engineering review.
Sourcing & Quality Verification
Konmask.com sources Honeywell TDC 3000 / TPS modules through established industrial automation component supply channels, including decommissioned plant asset recovery, authorized distributor surplus, and verified secondary-market sources with documented chain of custody. All modules undergo a structured incoming inspection process before listing.
4-Step Incoming Inspection Process:
- Visual & Physical Inspection: Board-level examination for component damage, corrosion, burn marks, missing components, and connector pin integrity. Modules with evidence of field damage or unauthorized repair are rejected.
- Part Number & Revision Verification: Confirmation of Honeywell part number label (10101/2/1), hardware revision suffix, and date code against Honeywell product documentation to ensure the module matches the listed specification.
- Functional Bench Test: Where test infrastructure permits, modules are powered and exercised against known-good reference signals to verify input channel response and backplane communication handshake.
- Packaging & ESD Protection: Modules are packaged in anti-static bags with ESD warning labeling and cushioned outer packaging to prevent transit damage.
Documentation Available Upon Request:
- Inspection report / test record
- Honeywell original datasheet / product specification (publicly available)
- Photos of actual module (top, bottom, connector, label)
- Certificate of conformance (where applicable)
- Export compliance documentation (HS code, country of origin)
Procurement Process
- Inquiry Submission: Submit part number (10101/2/1), required quantity, hardware revision preference (if applicable), and delivery timeline via the contact form or email at support@konmask.com. Include the target system (TDC 3000 / TPS) and application context if technical pre-sales consultation is required.
- Quotation & Availability Confirmation: A detailed quotation including unit price, lead time, shipping options, and available inspection documentation will be issued within 24 hours of inquiry receipt on business days.
- Order Confirmation & Shipment: Upon purchase order acceptance, modules are prepared, re-inspected, and dispatched with full shipping documentation. Express international freight options are available for urgent plant maintenance requirements.
Technical Support: Pre-sales technical consultation is available for compatibility verification, system architecture questions, and substitution assessments. Post-sales support covers shipping documentation, customs paperwork, and coordination with Honeywell’s technical resources for installation guidance.
Technical FAQ
Q: Is the Honeywell 10101/2/1 compatible with both TDC 3000 and TotalPlant Solution (TPS) systems?
A: Yes. The TPS platform is the evolved successor to TDC 3000, and the I/O Link architecture and module form factor are preserved across both generations. The 10101/2/1 DI module is compatible with TDC 3000 and TPS I/O carriers and controller types (PM, HPPM) without hardware modification, provided the backplane slot and carrier assembly match the module’s physical footprint.
Q: What are the acceptable substitute part numbers if the 10101/2/1 is unavailable?
A: Functional substitution within the Honeywell TDC 3000 DI module family depends on channel count, isolation type, and I/O carrier compatibility. Potential candidates include other Honeywell TDC 3000 digital input modules with equivalent channel density and I/O Link interface. Any substitution must be validated against Honeywell’s supersession list and the specific I/O carrier assembly drawing. Contact support@konmask.com with system details for a substitution assessment before committing to an alternative part.
Q: Can this module be used in a Safety Instrumented System (SIS) or SIL-rated application?
A: No. The Honeywell 10101/2/1 is a standard process control DI module and is not independently certified to IEC 61508 or IEC 61511 SIL requirements. SIS applications in petrochemical, power, or water treatment facilities require Honeywell Safety Manager (SM) or equivalent IEC 61511-certified hardware. Using this module in a SIL-rated safety loop without a formal functional safety assessment and proof-test documentation would be non-compliant with process safety management standards.
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