Tokyo Electron TTLA08-13 F-MFC_AI_4 PCB Assembly | XC-ES30 / XC-ES30CE MFC Platform
Engineering Background
The Tokyo Electron (TEL) XC-ES30 and XC-ES30CE are precision mass flow controller (MFC) platforms widely deployed in CVD, ALD, and etch process chambers across leading semiconductor fabs. The F-MFC_AI_4 analog input PCB assembly (TTLA08-13) serves as the core signal-conditioning and control interface board within these MFC units, directly governing gas flow accuracy and process repeatability at the sub-sccm level.
Product Positioning
This listing covers the OEM-equivalent PCB assembly sourced through verified TEL supply channels. It is intended for process engineers and equipment maintenance teams requiring a drop-in replacement for the 3880-200122-14 / 3895-120917-14 board assembly in XC-ES30 and XC-ES30CE MFC configurations. The BHM6180M-G suffix denotes the specific hardware revision qualified for high-purity gas service.
Complete Technical Specifications
- OEM Part Number: TTLA08-13
- Assembly P/N (Primary): 3880-200122-14
- Assembly P/N (Alternate): 3895-120917-14
- Hardware Revision: BHM6180M-G
- Board Type: F-MFC_AI_4 — Analog Input PCB Assembly
- Compatible Platform: XC-ES30 / EX1.5C / XC-ES30CE MFC Series
- Manufacturer: Tokyo Electron Limited (TEL)
- Form Factor: Single-board PCB assembly with edge connector interface
- Signal Type: Analog input (AI), 4-channel configuration
- Weight: 2,600 g (packaged)
- Condition: New / Refurbished OEM (specify at inquiry)
- Lead Time: Subject to stock availability — contact for confirmation
Proven Application Environments
- Chemical Vapor Deposition (CVD) process chambers requiring precise gas flow control
- Atomic Layer Deposition (ALD) tools with multi-channel MFC configurations
- Plasma etch systems using TEL XC-ES30 / XC-ES30CE MFC units
- Diffusion furnace gas delivery systems in 200 mm and 300 mm fab environments
- High-purity specialty gas lines (corrosive and non-corrosive process gases)
- TEL Trias, Tactras, and Vigus platform tool families
Engineering Advantages
- OEM Traceability: Part numbers cross-referenced against TEL BOM documentation for verified compatibility
- Drop-in Replacement: Identical form, fit, and function to original installed board — no firmware modification required
- Revision-Locked: BHM6180M-G hardware revision ensures compatibility with existing XC-ES30CE calibration data
- Process Integrity: Maintains sub-1% full-scale flow accuracy critical for advanced node deposition processes
- Reduced Downtime: Ready-to-install assembly eliminates component-level rework and re-qualification cycles
- Dual P/N Coverage: Satisfies both 3880-200122-14 and 3895-120917-14 procurement requisitions
System Architecture & Signal Flow
Within the XC-ES30 MFC architecture, the F-MFC_AI_4 board receives analog sensor signals from the thermal mass flow sensor element and conditions them through precision instrumentation amplifiers before passing digitized values to the MFC’s main control processor. The 4-channel AI configuration supports multi-range sensor inputs, enabling the MFC to operate across wide flow ranges (typically 10 sccm to 30 slm depending on gas calibration). The TTLA08-13 board interfaces via a dedicated edge connector to the MFC backplane, with no field-configurable jumpers required for standard XC-ES30CE installations.
Sourcing & Quality Verification
- All units are inspected against TEL part number markings and revision codes prior to shipment
- Packaging includes anti-static ESD protection per JEDEC J-STD-033 guidelines
- Certificates of conformance (CoC) available upon request for fab qualification records
- Traceability documentation provided for ISO 9001-compliant maintenance programs
- Units sourced from decommissioned tools undergo functional verification and cleaning before listing
Procurement Process
- Submit your inquiry with tool serial number and current MFC P/N for cross-reference confirmation
- Receive stock availability confirmation and lead time within 1 business day
- Review and approve proforma invoice — payment via T/T, PayPal, or trade terms
- Unit ships with ESD packaging, CoC, and packing list within agreed lead time
- Post-delivery technical support available via email or WhatsApp
Technical FAQ
Q: Is this board compatible with both XC-ES30 and XC-ES30CE variants?
A: Yes. The TTLA08-13 / BHM6180M-G revision is qualified for both XC-ES30 and XC-ES30CE platforms. Confirm your MFC serial number prefix for final verification.
Q: Does this replace both P/N 3880-200122-14 and 3895-120917-14?
A: Yes. Both part numbers refer to the same F-MFC_AI_4 board assembly at different BOM revision levels. This unit satisfies both requisitions.
Q: Can you provide a functional test report?
A: Functional test reports are available for refurbished units. New OEM units ship with manufacturer CoC. Please specify your requirement at time of order.
Q: What is the typical lead time?
A: In-stock units ship within 3–5 business days. Out-of-stock items are subject to sourcing lead time — typically 2–6 weeks. Contact us for real-time availability.
Q: Do you accept returns or offer warranty?
A: We offer a 90-day warranty against manufacturing defects on all verified units. DOA claims are handled within 5 business days of receipt.
© 2026 Konmask.com. All rights reserved.
Original Source: https://Konmask.com
Contact: [email protected] | +0086 19859288691
