Wafer Backgrinding Solution – TOKYO SEIMITSU Rough Grinding Wheel 250D 30T 190H | TD325X2-3W Series
Where This Product Is Used
The TOKYO SEIMITSU TD325X2-3W Rough Grinding Wheel (AP3550SM) is engineered for the rough grinding (backgrinding) stage of semiconductor wafer thinning. It is mounted on TOKYO SEIMITSU (Accretech) fully-automatic wafer back-grinders and is the industry-standard consumable for:
- Silicon wafer thinning prior to dicing (200 mm / 300 mm wafer lines)
- Power device substrate preparation (SiC, GaAs, InP)
- MEMS device wafer thinning
- Advanced packaging back-end processes (Fan-Out WLP, 3D-IC stacking)
- LED substrate thinning (sapphire, GaN-on-Si)
- Automotive-grade IGBT module wafer preparation
Facilities running TOKYO SEIMITSU PG300RM, PG310, PG320, or equivalent Accretech grinders specify this wheel as the primary rough-cut consumable to achieve high material-removal rates before transitioning to fine-grinding wheels.
Technical Specifications
| Part Number (SKU) | 0040-20006 |
| Manufacturer Part No. | TD325X2-3W / AP3550SM |
| Brand | TOKYO SEIMITSU (Accretech) |
| Wheel Outer Diameter (D) | 250 mm |
| Wheel Thickness (T) | 30 mm |
| Bore / Arbor Hole (H) | 190 mm |
| Wheel Type | Rough Grinding (Backgrinding) |
| Abrasive Grade | AP3550SM (Diamond Segment) |
| Series | TD325X2-3W |
| Application | Semiconductor Wafer Backgrinding |
| Compatible Equipment | TOKYO SEIMITSU / Accretech Back-Grinders |
| Country of Origin | Japan |
Why Engineers Specify This Model
- High MRR (Material Removal Rate) – The AP3550SM diamond bond matrix is optimized for aggressive stock removal in the rough-grind pass, reducing cycle time per wafer.
- Consistent TTV (Total Thickness Variation) – Precision-balanced 250 mm wheel geometry maintains sub-micron TTV targets critical for advanced node devices.
- Long Wheel Life – Self-dressing diamond segment design minimizes dressing frequency, lowering cost-per-wafer in high-volume production.
- Drop-in Compatibility – Direct OEM replacement for TOKYO SEIMITSU grinders; no spindle adapter or parameter re-qualification required.
- Reduced Sub-Surface Damage (SSD) – Engineered grit distribution limits crack propagation depth, protecting device layers during aggressive thinning.
Complete System Bill of Materials
For a complete wafer backgrinding consumable set on TOKYO SEIMITSU grinders, engineers typically specify:
- ✅ Rough Grinding Wheel – TD325X2-3W AP3550SM (this item, SKU 0040-20006)
- Fine Grinding Wheel – TOKYO SEIMITSU compatible fine-grit wheel (contact us for matching SKU)
- Wafer Backgrinding Tape (UV or non-UV type)
- Grinding Water / Coolant (DI water system)
- Wheel Flange / Chuck Table (machine-specific)
- Dressing Board (for wheel conditioning)
Contact [email protected] for a complete BOM quotation.
Compliance & Industry Standards
- Manufactured under ISO 9001 quality management system
- Compatible with SEMI M1 (Silicon Wafer) and SEMI M55 (SiC Wafer) process requirements
- RoHS compliant – no restricted hazardous substances in wheel bond matrix
- Traceable lot documentation available upon request for IATF 16949 / automotive-grade fabs
Quality Assurance & Sourcing
Konmask.com sources TOKYO SEIMITSU consumables through authorized distribution channels with full traceability. Every unit is:
- Inspected for dimensional conformance (D / T / H tolerances) before dispatch
- Shipped in original OEM packaging with lot number and date code
- Stored in climate-controlled warehousing to preserve bond integrity
- Backed by our authenticity guarantee – counterfeit-free supply chain
How to Source This Part
To place an order or request a formal quotation for the TOKYO SEIMITSU TD325X2-3W AP3550SM Rough Grinding Wheel (0040-20006):
- 📧 Email: [email protected]
- 📞 Phone / WhatsApp: +0086 19859288691
- 🌐 Website: https://Konmask.com
Lead time, MOQ, and volume pricing available on request. We support urgent / expedited sourcing for fab line-down situations.
Application-Specific FAQ
Q: Is this wheel compatible with 300 mm wafer backgrinding?
A: The 250 mm outer diameter wheel is designed for use on TOKYO SEIMITSU grinders processing wafers up to 300 mm. Compatibility depends on your specific machine model — contact us to confirm.
Q: What is the difference between TD325X2-3W and other TD-series wheels?
A: The TD325X2-3W designation indicates the wheel segment geometry and bond type optimized for rough-cut passes. It is distinct from fine-grinding variants (e.g., TD325X2-5W or similar) which use finer grit for finish passes.
Q: Can this wheel be used for SiC wafer grinding?
A: Diamond-bond wheels in the AP series are suitable for hard substrates including SiC. However, process parameters (feed rate, spindle speed) must be adjusted. Consult your process engineer and contact us for SiC-specific recommendations.
Q: Do you offer consignment or blanket PO arrangements?
A: Yes. For high-volume fabs with recurring consumption, we offer scheduled delivery programs. Contact our sales team for details.
Q: What documentation can you provide?
A: We can provide commercial invoice, packing list, certificate of conformance (CoC), and lot traceability documentation upon request.
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Contact: [email protected] | +0086 19859288691
